催化学报

催化学报 ›› 2008, Vol. 29 ›› Issue (11): 1122-1126.

• 研究论文 • 上一篇    下一篇

双层铜金属薄膜纳米压痕机械性能的分子动力学模拟

廖明亮1, 翁盟雄2, 朱训鹏2, 江幸蓉2   

  1. 1 空军航空技术学院飞机工程学系, 台湾高雄 80424; 2 中山大学机械与机电工程学系纳米科技与科学中心, 台湾高雄 80424
  • 收稿日期:2008-11-25 出版日期:2008-11-25 发布日期:2012-08-17

Molecular Dynamics Simulation on the Nanoindentation Behavior of a Copper Bilayered Thin Film

LIAO Ming-Liang1, WENG Meng-Hsiung2, JU Shin-Pon2*, CHIANG Hsing-Jung2   

  1. 1 Department of Aircraft Engineering, Air Force Institute of Technology, Kaohsiung 80424, Taiwan, China;
  • Received:2008-11-25 Online:2008-11-25 Published:2012-08-17

PDF

705

被引次数

1

摘要： 多层金属薄膜的机械性质在纳米组件的设计上是非常重要的. 目前,纳米尺度材料的机械性质测量的最主要方法为纳米压痕检测技术. 本文应用分子动力学理论对双层铜金属薄膜界面的结构形态与特性进行分析探讨. 选用FCC结构单晶铜的(100)面,(110)面和双层铜金属薄膜作为探讨界面性质的材料,进而探讨了单晶铜及双层铜金属薄膜的纳米压痕变形性质.

关键词: 双层薄膜, 铜, 纳米压痕, 分子动力学模拟

Abstract: Nanoindentation is one of widely used tools for examining mechanical propert ies of metal thin films. In this study, molecular dynamics simulation was e mployed to investigate the nanoindentation behavior of a Cu(100)/Cu(110) bilayer ed thin film. The detailed deformation structure of the bilayered thin film was observed to be similar to that of its ingredients and correlated very well with the load-displacement response.

Key words: bilayered thin film, copper, nanoindentation, molecular dynamics simulation